Series :
Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Applied Filters :
27434 results
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN $proddata[$product['id']]['package'] Obsolete                                
Default Photo
RFQ
VIEW
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN $proddata[$product['id']]['package'] Obsolete                                
Default Photo
RFQ
VIEW
RFQ
Samtec Inc. CONN SOCKET PLCC 32POS TIN $proddata[$product['id']]['package'] PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
Per Unit
$188.68
RFQ
VIEW
RFQ
3M BGA 1MM 25 25MM 23 MATRIX 168PIN   Active                                
Default Photo
Per Unit
$154.11
RFQ
VIEW
RFQ
3M BGA SOCKET 1MM 676 POS 26X26   Active           BGA                    
Default Photo
Per Unit
$91.63
RFQ
VIEW
RFQ
3M 10X10 GRID ZIP SOCKET $proddata[$product['id']]['package']   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$57.81
RFQ
VIEW
RFQ
3M BGA 1.00MM 9X9 8X8 64 PIN   Active                                
Default Photo
Per Unit
$34.40
RFQ
VIEW
RFQ
TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD $proddata[$product['id']]['package']   Active     Surface Mount Solder Open Frame LGA Thermoplastic   Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy   30.0µin (0.76µm) Copper Alloy
Default Photo
Per Unit
$16.16
RFQ
VIEW
RFQ
TE Connectivity AMP Connectors DUAL LGA,257 POS, DMD SOCKET $proddata[$product['id']]['package'] DMD Active   -25°C ~ 100°C Surface Mount Solder Board Guide, Open Frame LGA Thermoplastic 0.039" (1.00mm) Gold 3.00µin (0.076µm)   257 (20 x 30) Copper Alloy      
Default Photo
Per Unit
$14.26
RFQ
VIEW
RFQ
TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD $proddata[$product['id']]['package']   Active     Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1151 Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
Default Photo
Per Unit
$6.44
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$6.16
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$5.24
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$4.38
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.45
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.43
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$2.09
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$1.66
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
Default Photo
Per Unit
$1.54
RFQ
VIEW
RFQ
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.30
RFQ
RFQ
100
In-stock
Harwin Inc. CONN SOCKET SIP 32POS TIN $proddata[$product['id']]['package'] D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
Default Photo
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$2.75
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$1.89
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
RFQ
RFQ
700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$2.16
RFQ
RFQ
700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$1.27
RFQ
RFQ
700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$1.41
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] Active                                
Default Photo
Per Unit
$0.95
RFQ
RFQ
450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
RFQ
RFQ
275
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN $proddata[$product['id']]['package'] Active