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87 results
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
44-6575-18
Per Unit
$120.13
 RFQ
RFQ
1,002
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6574-18
Per Unit
$120.13
 RFQ
RFQ
2,595
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-3575-18
Per Unit
$120.13
 RFQ
RFQ
2,010
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-3574-18
Per Unit
$120.13
 RFQ
RFQ
1,398
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6554-16
Per Unit
$51.47
 RFQ
RFQ
1,656
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
44-6556-40
Per Unit
$39.70
 RFQ
RFQ
2,947
In-stock
 Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
44-3552-16
Per Unit
$46.88
 RFQ
RFQ
1,069
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
44-3551-16
Per Unit
$46.88
 RFQ
RFQ
2,707
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
44-6553-16
Per Unit
$46.88
 RFQ
RFQ
3,863
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
Default Photo
44-3573-16
Per Unit
$36.88
 RFQ
RFQ
3,664
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 44 (2 x 22) Beryllium Nickel 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Nickel
Default Photo
44-6556-41
Per Unit
$43.20
 RFQ
RFQ
3,319
In-stock
 Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
44-6556-21
Per Unit
$22.36
 RFQ
RFQ
1,211
In-stock
 Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
44-6556-31
Per Unit
$22.36
 RFQ
RFQ
632
In-stock
 Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
Default Photo
44-6554-11
Per Unit
$19.99
 RFQ
RFQ
1,748
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-6553-11
Per Unit
$17.99
 RFQ
RFQ
656
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-3554-11
Per Unit
$17.99
 RFQ
RFQ
2,820
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-6552-11
Per Unit
$17.99
 RFQ
RFQ
3,945
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-6551-11
Per Unit
$17.99
 RFQ
RFQ
3,179
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-3553-11
Per Unit
$17.99
 RFQ
RFQ
2,688
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-3552-11
Per Unit
$17.99
 RFQ
RFQ
3,835
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-3551-11
Per Unit
$17.99
 RFQ
RFQ
2,975
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
Default Photo
44-6571-10
Per Unit
$16.76
 RFQ
RFQ
3,960
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6575-10
Per Unit
$16.76
 RFQ
RFQ
3,228
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6574-10
Per Unit
$16.76
 RFQ
RFQ
853
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6573-10
Per Unit
$16.76
 RFQ
RFQ
3,667
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6572-10
Per Unit
$16.76
 RFQ
RFQ
784
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-6570-10
Per Unit
$16.76
 RFQ
RFQ
799
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-3575-10
Per Unit
$16.76
 RFQ
RFQ
1,172
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-3574-10
Per Unit
$16.76
 RFQ
RFQ
2,335
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
44-3573-10
Per Unit
$16.76
 RFQ
RFQ
1,221
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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