Contact Finish - Mating :
Contact Finish - Post :
Number of Positions or Pins (Grid) :
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
Per Unit
$91.63
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3M 10X10 GRID ZIP SOCKET $proddata[$product['id']]['package']   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$6.16
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$5.24
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$4.38
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.45
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.43
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$2.09
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$1.66
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
Default Photo
Per Unit
$7.30
RFQ
RFQ
100
In-stock
Harwin Inc. CONN SOCKET SIP 32POS TIN $proddata[$product['id']]['package'] D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
Default Photo
Per Unit
$4.13
RFQ
RFQ
2,702
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] 500 Active   -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing   0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 0.100" (2.54mm) 25.0µin (0.63µm) Copper Alloy
Default Photo
Per Unit
$27.71
RFQ
RFQ
2,753
In-stock
Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper 0.050" (1.27mm) - Brass
Default Photo
Per Unit
$27.70
RFQ
RFQ
3,094
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$27.53
RFQ
RFQ
3,631
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
Default Photo
Per Unit
$27.40
RFQ
RFQ
2,828
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$27.40
RFQ
RFQ
3,252
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$27.40
RFQ
RFQ
2,829
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.025" (0.64mm) 200.0µin (5.08µm) Phosphor Bronze
Default Photo
Per Unit
$27.33
RFQ
RFQ
3,999
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
Default Photo
RFQ
RFQ
1,269
In-stock
Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass 0.100" (2.54mm) - Brass
Default Photo
RFQ
RFQ
1,472
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - Tin 4 (Round) Beryllium Copper - - Brass
Default Photo
RFQ
RFQ
3,340
In-stock
Harwin Inc. CONN SOCKET SIP 46POS GOLD D01-950 Obsolete Tube -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 46 (1 x 46) Beryllium Copper 0.100" (2.54mm) - Brass
Default Photo
RFQ
RFQ
3,043
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
Default Photo
RFQ
RFQ
2,601
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Brass
Default Photo
RFQ
RFQ
3,037
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) Tin-Lead 3 (Oval) Beryllium Copper - - Beryllium Copper
Default Photo
RFQ
RFQ
3,389
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Silver 500.0µin (12.70µm) Silver 3 (Oval) Beryllium Copper - - Beryllium Copper
Default Photo
RFQ
RFQ
1,036
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Silver 50.0µin (1.27µm) Silver 3 (Oval) Beryllium Copper - - Beryllium Copper
Default Photo
RFQ
RFQ
1,530
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
Default Photo
RFQ
RFQ
1,882
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Gold 3 (Round) Beryllium Copper - - Brass
Default Photo
RFQ
RFQ
3,654
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 8POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin 8 (Round) Copper Alloy - - Copper Alloy
Default Photo
RFQ
RFQ
2,750
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper - - Brass
Default Photo
RFQ
RFQ
1,182
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash Tin-Lead 18 (2 x 9) Copper Alloy 0.100" (2.54mm) 80.0µin (2.03µm) Copper Alloy