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112 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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|
RFQ |
3,835
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
1,452
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
3,874
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
1,192
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
2,104
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,740
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
2,410
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
1,665
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
1,705
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
3,599
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
1,443
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,888
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
2,886
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
952
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
1,436
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
2,937
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
1,831
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
3,304
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
3,077
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
|
RFQ |
3,335
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
991
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
3,991
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
1,124
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,299
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
1,928
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,982
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,788
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
2,742
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
1,151
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
RFQ |
3,329
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
