- Operating Temperature :
- Mounting Type :
- Termination :
- Features :
- Type :
-
- DIP, ZIF (ZIP) (1)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (5)
- DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing (2)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (15)
- DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing (2)
- DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing (1)
- PGA, ZIF (ZIP) (2)
- SIP, ZIF (ZIP) (5)
- Zig-Zag (2)
- Zig-Zag, ZIF (ZIP) (12)
- Pitch - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (1)
- 14 (2 x 7) (1)
- 16 (2 x 8) (1)
- 18 (2 x 9) (1)
- 20 (1 x 20) (1)
- 20 (2 x 10) (1)
- 22 (2 x 11) (1)
- 24 (1 x 24) (1)
- 24 (2 x 12) (3)
- 28 (2 x 14) (4)
- 32 (1 x 32) (1)
- 32 (2 x 16) (5)
- 34 (1 x 34) (1)
- 34 (2 x 17) (3)
- 35 (1 x 17, 1 x 18) (4)
- 36 (1 x 36) (1)
- 39 (1 x 19, 1 x 20) (2)
- 40 (2 x 20) (3)
- 42 (2 x 21) (3)
- 48 (2 x 24) (1)
- 51 (1 x 25, 1 x 26) (4)
- 56 (2 x 28) (1)
- 64 (2 x 32) (2)
- 90 (2 x 45) (1)
47 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
|
RFQ |
1,267
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | |||
|
|
|
RFQ |
2,639
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | |||
|
|
|
RFQ |
3,079
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | |||
|
|
|
RFQ |
1,594
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | |||
|
|
|
RFQ |
1,340
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | |||
|
|
|
RFQ |
1,425
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | |||
|
|
|
RFQ |
3,872
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | |||
|
|
|
RFQ |
1,541
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | |||
|
|
|
RFQ |
2,113
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | |||
|
|
|
RFQ |
2,128
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (1 x 34) | Beryllium Copper | |||
|
|
|
RFQ |
3,597
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | |||
|
|
|
RFQ |
941
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | |||
|
|
|
RFQ |
2,422
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
|
RFQ |
1,947
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
RFQ |
1,283
In-stock
|
3M | CONN SOCKET SIP ZIF 24POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | - | 24 (1 x 24) | Beryllium Copper | |||
|
|
RFQ |
1,367
In-stock
|
3M | CONN IC DIP SOCKET ZIF 24POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | |||
|
|
RFQ |
2,115
In-stock
|
3M | CONN IC DIP SOCKET ZIF 42POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 42 (2 x 21) | Beryllium Copper | |||
|
|
RFQ |
1,089
In-stock
|
3M | CONN IC DIP SOCKET ZIF 18POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 18 (2 x 9) | Beryllium Copper | |||
|
|
RFQ |
2,294
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
RFQ |
1,855
In-stock
|
3M | CONN IC DIP SOCKET ZIF 22POS GLD | Textool™ | Active | Tube | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 22 (2 x 11) | Beryllium Copper | |||
|
|
RFQ |
2,420
In-stock
|
3M | CONN IC DIP SOCKET ZIF 64POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 64 (2 x 32) | Beryllium Copper | |||
|
|
RFQ |
792
In-stock
|
3M | CONN SOCKET SIP ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | - | 32 (1 x 32) | Beryllium Copper | |||
|
|
RFQ |
815
In-stock
|
3M | CONN IC DIP SOCKET ZIF 40POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 40 (2 x 20) | Beryllium Copper | |||
|
|
RFQ |
1,410
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | |||
|
|
RFQ |
776
In-stock
|
3M | CONN IC DIP SOCKET ZIF 24POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 24 (2 x 12) | Beryllium Copper | |||
|
|
RFQ |
2,844
In-stock
|
3M | CONN IC DIP SOCKET ZIF 28POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | |||
|
|
RFQ |
2,043
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
RFQ |
2,835
In-stock
|
3M | CONN IC DIP SOCKET ZIF 42POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 42 (2 x 21) | Beryllium Copper | |||
|
|
RFQ |
2,038
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Connector | Press-Fit | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | |||
|
|
RFQ |
2,126
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | |||
