- Series :
-
- - (319)
- 100 (4)
- 101 (1)
- 104 (2)
- 110 (27)
- 111 (3)
- 114 (9)
- 115 (10)
- 116 (29)
- 121 (2)
- 122 (3)
- 123 (6)
- 124 (2)
- 126 (3)
- 146 (7)
- 210 (6)
- 214 (2)
- 299 (12)
- 4800 (2)
- 500 (16)
- 501 (12)
- 503 (12)
- 508 (8)
- 511 (6)
- 518 (15)
- 600 (1)
- 612 (2)
- 614 (7)
- 6621 (1)
- 700 (2)
- 714 (1)
- 8 (38)
- 800 (17)
- BU (1)
- BU-178HT (1)
- Correct-A-Chip® 1109800 (1)
- D0 (2)
- D2 (1)
- D26 (1)
- D39 (1)
- D95 (1)
- Diplomate DL (10)
- DPF3 (1)
- ED (1)
- Edge-Grip™, C81 (1)
- Edge-Grip™, C91 (1)
- ICA (5)
- iCF (6)
- ICO (6)
- Lo-PRO®file, 513 (20)
- SA (2)
- Textool™ (1)
- Vertisockets™ 800 (35)
- WMS (1)
- XR2 (6)
- Part Status :
- Termination :
- Housing Material :
-
- Aluminum Alloy (2)
- Liquid Crystal Polymer (LCP) (6)
- Plastic (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (27)
- Polyamide (PA46), Nylon 4/6, Glass Filled (124)
- Polybutylene Terephthalate (PBT) (6)
- Polybutylene Terephthalate (PBT), Glass Filled (12)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (5)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (70)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (73)
- Polyester (10)
- Polyester, Glass Filled (13)
- Polyethersulfone (PES), Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic (5)
- Thermoplastic, Glass Filled (7)
- Thermoplastic, Polyester (19)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish - Mating :
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
404 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
|
VIEW | Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | $proddata[$product['id']]['package'] | XR2 | Active | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 8 (2 x 4) | Beryllium Copper | Flash | Beryllium Copper | ||||
|
|
|
VIEW | Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | $proddata[$product['id']]['package'] | XR2 | Active | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
|
|
|
RFQ |
450
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | $proddata[$product['id']]['package'] | iCF | Active | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | |||||
|
|
|
RFQ |
450
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | $proddata[$product['id']]['package'] | iCF | Active | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | 8 (2 x 4) | Beryllium Copper | Beryllium Copper | |||||
|
|
|
RFQ |
2,702
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | $proddata[$product['id']]['package'] | 500 | Active | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 8 (2 x 4) | Copper Alloy | 25.0µin (0.63µm) | Copper Alloy | ||||
|
|
RFQ |
2,912
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
|
|
RFQ |
3,956
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
|
|
RFQ |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
|
RFQ |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
RFQ |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
RFQ |
2,399
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
RFQ |
2,761
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 8 (2 x 4) | - | - | - | |||
|
|
RFQ |
3,557
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
|
RFQ |
938
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
RFQ |
3,601
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
|
RFQ |
1,478
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 8POS TIN-LEAD | DPF3 | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
RFQ |
802
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
|
|
RFQ |
3,394
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 8 (2 x 4) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
|
|
RFQ |
3,718
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 8 (2 x 4) | Copper Alloy | - | - | |||
|
|
|
RFQ |
2,676
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 8 (2 x 4) | Copper Alloy | - | Brass | |||
|
|
|
RFQ |
1,512
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
|
RFQ |
1,154
In-stock
|
3M | CONN IC DIP SOCKET 8POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | 8 (2 x 4) | Beryllium Copper | Flash | Brass | |||
|
|
|
RFQ |
3,255
In-stock
|
3M | CONN IC DIP SOCKET 8POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
|
RFQ |
843
In-stock
|
3M | CONN IC DIP SOCKET 8POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
|
RFQ |
726
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
|
RFQ |
2,168
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | 800 | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | 8 (2 x 4) | Copper Alloy | - | - | |||
|
|
RFQ |
2,140
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 8 (2 x 4) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
RFQ |
1,519
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
|
RFQ |
1,287
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
RFQ |
2,618
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | 8 (2 x 4) | - | - | - | |||
