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15 results
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
D95020-42
Per Unit
$1.53
 RFQ
RFQ
3,025
In-stock
 Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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D95018-42
Per Unit
$1.42
 RFQ
RFQ
2,302
In-stock
 Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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D95006-42
Per Unit
$0.56
 RFQ
RFQ
829
In-stock
 Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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D95040-42
Per Unit
$5.15
 RFQ
RFQ
2,930
In-stock
 Harwin Inc. CONN IC DIP SOCKET 42POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 42 (2 x 21) Beryllium Copper 196.9µin (5.00µm) Brass
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D95A48-42
Per Unit
$4.86
 RFQ
RFQ
616
In-stock
 Harwin Inc. CONN IC DIP SOCKET 48POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 48 (2 x 24) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95032-42
Per Unit
$3.30
 RFQ
RFQ
2,251
In-stock
 Harwin Inc. CONN IC DIP SOCKET 32POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95A22-42
Per Unit
$1.88
 RFQ
RFQ
2,398
In-stock
 Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95022-42
Per Unit
$1.85
 RFQ
RFQ
1,905
In-stock
 Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
D95028-42
D95028-42
Per Unit
$3.60
 RFQ
RFQ
1,809
In-stock
 Harwin Inc. CONN IC DIP SOCKET 28POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
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D95008-42
Per Unit
$0.67
 RFQ
RFQ
967
In-stock
 Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95A24-42
Per Unit
$2.20
 RFQ
RFQ
3,716
In-stock
 Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95B24-42
Per Unit
$2.13
 RFQ
RFQ
651
In-stock
 Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95024-42
Per Unit
$2.10
 RFQ
RFQ
1,286
In-stock
 Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95014-42
Per Unit
$1.09
 RFQ
RFQ
2,933
In-stock
 Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
D95016-42
Per Unit
$1.27
 RFQ
RFQ
1,761
In-stock
 Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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