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190 results
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
42-6575-18
Per Unit
$114.80
 RFQ
RFQ
3,180
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-6574-18
Per Unit
$114.80
 RFQ
RFQ
2,355
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-3575-18
Per Unit
$114.80
 RFQ
RFQ
1,594
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-3574-18
Per Unit
$114.80
 RFQ
RFQ
2,608
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
100-042-000
RFQ
RFQ
2,207
In-stock
 3M CONN IC DIP SOCKET 42POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 42 (2 x 21) Beryllium Copper Flash Brass
Default Photo
ICO-426-S8-T
RFQ
RFQ
1,312
In-stock
 3M CONN IC DIP SOCKET 42POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
Default Photo
ICO-426-S8A-T
RFQ
RFQ
1,522
In-stock
 3M CONN IC DIP SOCKET 42POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
Default Photo
390263-5
RFQ
RFQ
2,721
In-stock
 TE Connectivity AMP Connectors CONN IC DIP SOCKET 42POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 42 (2 x 21) Phosphor Bronze - Phosphor Bronze
Default Photo
42-6553-16
Per Unit
$44.75
 RFQ
RFQ
1,214
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-6552-16
Per Unit
$44.75
 RFQ
RFQ
2,395
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-6551-16
Per Unit
$44.75
 RFQ
RFQ
2,882
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-3553-16
Per Unit
$44.75
 RFQ
RFQ
1,586
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-3552-16
Per Unit
$44.75
 RFQ
RFQ
2,310
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-3551-16
Per Unit
$44.75
 RFQ
RFQ
3,314
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
42-6574-16
Per Unit
$36.51
 RFQ
RFQ
1,650
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-6575-16
Per Unit
$36.51
 RFQ
RFQ
2,678
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-6573-16
Per Unit
$36.51
 RFQ
RFQ
1,388
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-6572-16
Per Unit
$36.51
 RFQ
RFQ
3,680
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-6571-16
Per Unit
$36.51
 RFQ
RFQ
2,195
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-6570-16
Per Unit
$36.51
 RFQ
RFQ
2,827
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-3575-16
Per Unit
$36.51
 RFQ
RFQ
820
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-3574-16
Per Unit
$36.51
 RFQ
RFQ
3,134
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
42-3573-16
Per Unit
$36.51
 RFQ
RFQ
1,873
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-3572-16
Per Unit
$36.51
 RFQ
RFQ
1,974
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-3571-16
Per Unit
$36.51
 RFQ
RFQ
3,128
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-3570-16
Per Unit
$36.51
 RFQ
RFQ
648
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 42 (2 x 21) Beryllium Nickel 50.0µin (1.27µm) Beryllium Nickel
Default Photo
42-6556-41
Per Unit
$41.20
 RFQ
RFQ
3,239
In-stock
 Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
123-13-642-41-001000
Per Unit
$18.14
 RFQ
RFQ
1,024
In-stock
 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
124-93-642-41-002000
Per Unit
$17.82
 RFQ
RFQ
3,496
In-stock
 Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
42-6575-11
Per Unit
$23.14
 RFQ
RFQ
3,528
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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