Contact Finish - Mating :
Contact Finish - Post :
Number of Positions or Pins (Grid) :
Picture Mfr Part # Unit Price QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Samtec Inc. CONN SOCKET PLCC 32POS TIN $proddata[$product['id']]['package'] PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper   Beryllium Copper
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Per Unit
$6.44
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$6.16
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$5.24
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$4.38
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$2.45
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$2.43
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$2.09
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$1.66
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper Flash Beryllium Copper
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Per Unit
$1.54
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$7.30
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100
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Harwin Inc. CONN SOCKET SIP 32POS TIN $proddata[$product['id']]['package'] D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass   Brass
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Per Unit
$1.89
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper   Beryllium Copper
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Per Unit
$1.27
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700
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper   Beryllium Copper
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Per Unit
$0.95
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450
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper   Beryllium Copper
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Per Unit
$5.21
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275
In-stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 32 (2 x 16) Beryllium Copper   Beryllium Copper
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Per Unit
$2.15
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250
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS TIN $proddata[$product['id']]['package'] iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 28 (2 x 14) Beryllium Copper   Beryllium Copper
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Per Unit
$4.13
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2,702
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD $proddata[$product['id']]['package'] 500 Active   -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing   0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Copper Alloy 25.0µin (0.63µm) Copper Alloy
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Per Unit
$27.71
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2,753
In-stock
Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper - Brass
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Per Unit
$27.67
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2,773
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper - Brass
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Per Unit
$27.53
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RFQ
3,631
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper - Brass
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Per Unit
$27.47
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RFQ
3,782
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 279 (19 x 19) Beryllium Copper - Brass
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Per Unit
$27.33
RFQ
RFQ
3,999
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper - Brass
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RFQ
1,269
In-stock
Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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RFQ
1,472
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - Tin 4 (Round) Beryllium Copper - Brass
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1,977
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,925
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Silver 50.0µin (1.27µm) - 3 (Oval) Beryllium Copper - Beryllium Copper
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1,999
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,766
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,830
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Silver 500.0µin (12.70µm) - 3 (Oval) Beryllium Copper - Beryllium Copper
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1,681
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Tin-Lead 200.0µin (5.08µm) Copper 3 (Oval) Beryllium Copper 100.0µin (2.54µm) Beryllium Copper