- Part Status :
- Packaging :
- Operating Temperature :
- Mounting Type :
- Termination :
- Housing Material :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
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224 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
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RFQ |
3,109
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 64POS GOLD | SA | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Gold | 64 (2 x 32) | Beryllium Copper | 80.0µin (2.03µm) | Brass | |||
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|
RFQ |
3,056
In-stock
|
On Shore Technology Inc. | CONN IC DIP SOCKET 64POS GOLD | SA | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
RFQ |
1,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
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RFQ |
1,256
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin | - | - | 64 (2 x 32) | Copper Alloy | - | - | |||
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|
RFQ |
668
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
RFQ |
1,456
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
RFQ |
1,908
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
RFQ |
721
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
3,531
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
1,403
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
|
RFQ |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
|
RFQ |
3,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
RFQ |
995
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
RFQ |
3,769
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
2,430
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
1,939
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
|
RFQ |
3,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
RFQ |
3,867
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
RFQ |
2,248
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
|
RFQ |
1,429
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 52 (2 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
RFQ |
2,605
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 52 (2 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
626
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 52 (2 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
3,826
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
2,502
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
|
RFQ |
2,224
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
2,837
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
|
RFQ |
2,019
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
|
RFQ |
3,734
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
|
RFQ |
1,097
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 52 (2 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
|
RFQ |
3,973
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
