- Manufacture :
-
- ON Semiconductor (743)
- ABLIC U.S.A. Inc. (219)
- Adesto Technologies (194)
- AKM Semiconductor Inc. (2)
- Cypress Semiconductor Corp (244)
- Fremont Micro Devices USA (420)
- Fujitsu Electronics America, Inc. (88)
- Microchip Technology (6907)
- Parallax Inc. (10)
- Renesas Electronics America (40)
- Rohm Semiconductor (1964)
- STMicroelectronics (1260)
- Fremont Micro Devices Ltd (12)
- NXP USA Inc. (86)
- Maxim Integrated (19)
- Operating Temperature :
-
- -20°C ~ 125°C (TA) (34)
- -20°C ~ 85°C (TA) (182)
- -25°C ~ 85°C (TA) (14)
- -40°C ~ 105°C (TA) (122)
- -40°C ~ 125°C (TA) (1125)
- -40°C ~ 85°C (6)
- -40°C ~ 85°C (TA) (9271)
- -40°C ~ 85°C (TC) (448)
- -40°C ~ 85°C (TJ) (4)
- -55°C ~ 125°C (2)
- -55°C ~ 125°C (TA) (4)
- -55°C ~ 125°C (TC) (2)
- 0°C ~ 70°C (TA) (685)
- 0°C ~ 70°C (TC) (303)
- 0°C ~ 95°C (TA) (6)
- Mounting Type :
- Package / Case :
-
- 10-DIP (0.300", 7.62mm) (2)
- 11-UFBGA, CSPBGA (2)
- 12-WQFN Exposed Pad (4)
- 14-LSSOP (0.173", 4.40mm Width) (6)
- 14-SOIC (0.154", 3.90mm Width) (12)
- 14-TSSOP (0.173", 4.40mm Width) (20)
- 16-LSSOP (0.173", 4.40mm Width) (6)
- 16-SOIC (0.295", 7.50mm Width) (16)
- 20-SOIC (0.295", 7.50mm Width) (4)
- 36-XFBGA, CSP (4)
- 4-UFBGA, CSPBGA (4)
- 4-WFBGA, WLBGA (2)
- 4-XFBGA (8)
- 4-XFBGA, CSPBGA (24)
- 4-XFBGA, WLBGA (2)
- 4-XFBGA, WLCSP (125)
- 5-SIP Module (4)
- 5-TSSOP, SC-70-5, SOT-353 (57)
- 5-UFBGA, CSPBGA (10)
- 5-UFDFN (42)
- 5-XFBGA, WLCSP (18)
- 6-UFBGA, CSPBGA (20)
- 6-XFBGA, CSPBGA (40)
- 6-XFBGA, WLCSP (18)
- 8-DIP (0.300", 7.62mm) (867)
- 8-LSSOP (0.173", 4.40mm Width) (176)
- 8-SMD, Flat Lead (22)
- 8-SMD, Flat Lead Exposed Pad (22)
- 8-SOIC (0.154", 3.90mm Width) (3395)
- 8-SOIC (0.173", 4.40mm Width) (272)
- 8-SOIC (0.209", 5.30mm Width) (412)
- 8-SOIC (0.295", 7.50mm Width) (12)
- 8-TDFN (34)
- 8-TSSOP (0.173", 4.40mm Width) (2406)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (753)
- 8-UBGA, WLCSP (6)
- 8-UDFN Exposed Pad (62)
- 8-UFBGA (6)
- 8-UFBGA, CSPBGA (4)
- 8-UFBGA, WLCSP (30)
- 8-UFDFN Exposed Pad (858)
- 8-VDFN Exposed Pad (64)
- 8-VFBGA (36)
- 8-VFDFN Exposed Pad (164)
- 8-VFSOP (0.091", 2.30mm Width) (4)
- 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) (192)
- 8-VSSOP, 8-MSOP (0.118", 3.00mm Width) (8)
- 8-WDFN Exposed Pad (14)
- 8-WFBGA, WLCSP (6)
- 8-WFDFN Exposed Pad (535)
- 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) (36)
- 8-XFBGA, WLCSP (8)
- 8-XFDFN (6)
- M2 J, Smart Card Module (ISO) (87)
- M2 J, Smart Card Module (TWI) (78)
- M2 P, Smart Card Module (ISO) (63)
- M2 P, Smart Card Module (TWI) (69)
- SC-74A, SOT-753 (354)
- SOT-23-5 Thin, TSOT-23-5 (188)
- SOT-23-6 (156)
- Supplier Device Package :
-
- 10-PDIP (2)
- 11-VCSP50L2 (2.44x1.99) (2)
- 12-TQFN (4x4) (4)
- 14-SOIC (6)
- 14-SOP (6)
- 14-SSOP (6)
- 14-TSSOP (20)
- 16-SOIC (16)
- 16-SSOPB (6)
- 20-SOIC (4)
- 4-CSP (22)
- 4-WLCSP (46)
- 4-WLCSP (0.76x0.76) (4)
- 4-WLCSP (0.80x0.67) (12)
- 4-WLCSP (0.84x0.84) (2)
- 4-WLCSP (0.84x0.86) (18)
- 4-WLCSP (0.85x0.85) (21)
- 4-WLCSP (2x2) (30)
- 4-WLP (0.79x1.06) (4)
- 5-CSP (4)
- 5-TSOP (2)
- 5-UCSP50L1 (1.1x1.15) (6)
- 5-UFDFPN (1.7x1.4) (42)
- 5-WLCSP (14)
- 5-WLCSP (1.20x0.80) (2)
- 5-WLCSP (1.34x0.91) (2)
- 5-WLCSP (3x3) (6)
- 6-UCSP25L1 (1.5x1) (6)
- 6-WLCSP (8)
- 6-WLCSP (1.2x0.80) (10)
- 8-CSP (4)
- 8-dBGA (2x1.5) (2)
- 8-dBGA (3.73x2.35) (2)
- 8-dBGA (4.07x2.47) (4)
- 8-DFN (2x3) (228)
- 8-DFN-S (6x5) (60)
- 8-DIP (103)
- 8-DIP-T (42)
- 8-LAP (2)
- 8-LAP (5x6) (2)
- 8-LAP (5x8) (30)
- 8-MAP (3x4.9) (48)
- 8-MFP (14)
- 8-Mini Map (2x3) (110)
- 8-MLP (2x3) (74)
- 8-MSOP (675)
- 8-PDIP (722)
- 8-SAP (4.9x6.0) (16)
- 8-SO (649)
- 8-SOIC (2384)
- 8-SOIJ (204)
- 8-SON (8)
- 8-SOP (590)
- 8-SOP-J (250)
- 8-SSOPB (186)
- 8-TDFN (2x3) (424)
- 8-TDFN (3x4.9) (2)
- 8-TDFN (4x4.5) (12)
- 8-TDFN-EP (2x3) (5)
- 8-TMSOP (36)
- 8-TSSOP (2263)
- 8-TSSOP-B (244)
- 8-TSSOP-BJ (168)
- 8-UDFN (2x3) (356)
- 8-UDFN-EP (2x3) (50)
- 8-UFDFPN (2x3) (138)
- 8-uMAX (1)
- 8-VFBGA (1.5x2) (28)
- 8-WLCSP (42)
- 8-WLCSP (1.785x1.38) (2)
- 8-WLCSP (3.56x2.01) (6)
- 8-XDFN (1.8x2.2) (6)
- M2 - J Module (ISO) (81)
- M2 - J Module (TWI) (78)
- M2 - P Module (ISO) (69)
- M2 - P Module (TWI) (69)
- SC-70-5 (57)
- SNT-8A (22)
- SOT-23-5 (500)
- TSOT-23-5 (40)
- UCSP30L1 (30)
- UCSP35L1 (12)
- US8 (4)
- VCSP30L1 (2)
- VCSP50L1 (20)
- VSON008X2030 (186)
- VSON8K (3.0x2.0) (2)
- Voltage - Supply :
-
- 1.5 V ~ 3.6 V (140)
- 1.6 V ~ 5.5 V (1159)
- 1.62 V ~ 5.5 V (1)
- 1.65 V ~ 3.6 V (146)
- 1.7 V ~ 3.6 V (487)
- 1.7 V ~ 5.5 V (3492)
- 1.8 V ~ 3.6 V (135)
- 1.8 V ~ 5.5 V (2144)
- 1.8 V ~ 6 V (10)
- 2 V ~ 3.6 V (44)
- 2 V ~ 5.25 V (4)
- 2.2 V ~ 5.5 V (79)
- 2.4 V ~ 5.5 V (4)
- 2.5 V ~ 3.6 V (28)
- 2.5 V ~ 5.5 V (2408)
- 2.5 V ~ 6 V (10)
- 2.5 V ~ 6.0 V (54)
- 2.7 V ~ 3.6 V (428)
- 2.7 V ~ 3.65 V (22)
- 2.7 V ~ 5.5 V (751)
- 3 V ~ 3.6 V (18)
- 3 V ~ 5.5 V (26)
- 4.5 V ~ 5.5 V (606)
- 4.5 V ~ 6 V (12)
- Memory Type :
- Memory Size :
-
- 128b (16 x 8) (148)
- 128K (16K x 8) (8)
- 128Kb (16K x 8) (700)
- 128kb (64B Page Size) (50)
- 16Kb (2K x 8) (1278)
- 1Kb (128 x 8) (1254)
- 1Kb (1K x 1) (2)
- 1Mb (128K x 8) (388)
- 256Kb (32K x 8) (694)
- 256kb (64B Page Size) (40)
- 2Kb (128 x 16) (4)
- 2Kb (128 x 8 x 2) (40)
- 2Kb (256 x 8) (2180)
- 2Mb (256K x 8) (34)
- 32Kb (2K x 16) (48)
- 32kb (32B Page Size) (33)
- 32Kb (4K x 8) (1021)
- 4Kb (256 x 8 x 2) (309)
- 4Kb (512 x 8) (1007)
- 512kb (128B Page Size) (22)
- 512Kb (64K x 8) (582)
- 64kb (32B Page Size) (39)
- 64Kb (8K x 8) (1239)
- 6Kb (256 x 8 x 3) (6)
- 896b (112 x 8) (8)
- 8Kb (1K x 8) (839)
- 8Kb (256 x 8 x 4) (235)
- Clock Frequency :
- Memory Format :
- Write Cycle Time - Word, Page :
- Applied Filters :
12208 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Technology | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Clock Frequency | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
|
RFQ |
2,271
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
2,441
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
2,282
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
3,689
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
2,779
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
1,457
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 2.7 V ~ 3.6 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
3,678
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
1,715
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
1,479
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
3,088
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
2,150
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
742
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM, SRAM | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8) | 400ns | 1MHz | EERAM | 1ms | I²C | |||
|
|
|
RFQ |
1,902
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 64Kb (8K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,402
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
2,216
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
1,434
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
670
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,595
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
2,970
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
738
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 4Kb (256 x 8 x 2) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,273
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 4Kb (256 x 8 x 2) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,584
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 4Kb (256 x 8 x 2) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
1,692
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 2Kb (256 x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
2,574
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | -40°C ~ 85°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 2Kb (256 x 8) | 900ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,891
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | 3500ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
907
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | 3500ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
1,284
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | 3500ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
2,481
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | Tape & Reel (TR) | EEPROM | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC | 2.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | 3500ns | 400kHz | EEPROM | 5ms | I²C | |||
|
|
|
RFQ |
3,362
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 128b (16 x 8) | 3500ns | 400kHz | EEPROM | 4ms | I²C | |||
|
|
|
RFQ |
932
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | EEPROM | 0°C ~ 70°C (TA) | - | - | - | 2.5 V ~ 5.5 V | Non-Volatile | 128b (16 x 8) | 3500ns | 400kHz | EEPROM | 4ms | I²C | |||
