- Manufacture :
-
- ON Semiconductor (1585)
- ABLIC U.S.A. Inc. (575)
- AKM Semiconductor Inc. (164)
- Fremont Micro Devices USA (560)
- Honeywell Microelectronics & Precision Sensors (4)
- Intersil (33)
- ISSI, Integrated Silicon Solution Inc (2)
- Microchip Technology (14663)
- Parallax Inc. (14)
- Renesas Electronics America (70)
- Rohm Semiconductor (2968)
- STMicroelectronics (2524)
- Winbond Electronics (2)
- Fremont Micro Devices Ltd (12)
- NXP USA Inc. (76)
- Maxim Integrated (384)
- Operating Temperature :
-
- -10°C ~ 70°C (TA) (2)
- -20°C ~ 125°C (TA) (34)
- -20°C ~ 85°C (TA) (188)
- -25°C ~ 85°C (TA) (14)
- -30°C ~ 85°C (TA) (11)
- -40°C ~ 105°C (TA) (228)
- -40°C ~ 125°C (TA) (2526)
- -40°C ~ 125°C (TC) (76)
- -40°C ~ 145°C (TA) (54)
- -40°C ~ 150°C (TA) (48)
- -40°C ~ 85°C (6)
- -40°C ~ 85°C (TA) (16290)
- -40°C ~ 85°C (TC) (1645)
- -40°C ~ 85°C (TJ) (4)
- -55°C ~ 125°C (2)
- -55°C ~ 125°C (TA) (22)
- -55°C ~ 125°C (TC) (210)
- -55°C ~ 225°C (TA) (4)
- 0°C ~ 70°C (TA) (1567)
- 0°C ~ 70°C (TC) (690)
- 0°C ~ 95°C (TA) (6)
- Mounting Type :
- Package / Case :
-
- 11-UFBGA, CSPBGA (2)
- 12-WQFN Exposed Pad (4)
- 12-XFBGA, CSPBGA (6)
- 14-DIP (0.300", 7.62mm) (2)
- 14-LSSOP (0.173", 4.40mm Width) (6)
- 14-SOIC (0.154", 3.90mm Width) (34)
- 14-TSSOP (0.173", 4.40mm Width) (46)
- 16-LSSOP (0.173", 4.40mm Width) (6)
- 16-SOIC (0.154", 3.90mm Width) (20)
- 16-SOIC (0.295", 7.50mm Width) (4)
- 2-SFN (28)
- 2-SMD, No Lead (12)
- 2-WDFN (15)
- 2-XDFN (12)
- 20-SOIC (0.295", 7.50mm Width) (6)
- 20-TSSOP (0.173", 4.40mm Width) (44)
- 24-DIP (0.600", 15.24mm) (31)
- 24-SOIC (0.295", 7.50mm Width) (58)
- 28-BCPGA (38)
- 28-CDIP (0.600", 15.24mm) (42)
- 28-CFlatPack (38)
- 28-DIP (0.600", 15.24mm) (178)
- 28-SOIC (0.295", 7.50mm Width) (345)
- 28-TSSOP (0.173", 4.40mm Width) (6)
- 28-TSSOP (0.173", 4.40mm Width) Exposed Pad (3)
- 28-TSSOP (0.465", 11.80mm Width) (294)
- 30-BCPGA (10)
- 32-CDIP (0.600", 15.24mm) (8)
- 32-CDIP (0.600", 15.24mm) Window (12)
- 32-CFlatpack (20)
- 32-CLCC (36)
- 32-DIP (0.600", 15.24mm) (37)
- 32-LCC (J-Lead) (567)
- 32-SOIC (0.295", 7.50mm Width) (14)
- 32-TFSOP (0.465", 11.80mm Width) (6)
- 32-TFSOP (0.724", 18.40mm Width) (77)
- 36-WFQFN Exposed Pad (3)
- 36-XFBGA, CSP (4)
- 4-UBGA, FCBGA (6)
- 4-UFBGA, CSPBGA (11)
- 4-WFBGA, WLBGA (2)
- 4-XFBGA (10)
- 4-XFBGA, CSPBGA (24)
- 4-XFBGA, WLBGA (2)
- 4-XFBGA, WLCSP (125)
- 44-CLCC (14)
- 5-TSSOP, SC-70-5, SOT-353 (57)
- 5-UFBGA, CSPBGA (10)
- 5-UFDFN (42)
- 5-XFBGA, WLCSP (18)
- 56-BCPGA (4)
- 6-LSOJ (0.148", 3.76mm Width) (75)
- 6-UFBGA, CSPBGA (22)
- 6-VBGA, FCBGA (2)
- 6-WDFN Exposed Pad (70)
- 6-WFBGA, CSPBGA (13)
- 6-WFDFN Exposed Pad (8)
- 6-XBGA, FCBGA (10)
- 6-XFBGA, CSPBGA (40)
- 6-XFBGA, WLCSP (14)
- 8-DIP (0.300", 7.62mm) (1718)
- 8-LSSOP (0.173", 4.40mm Width) (278)
- 8-SMD, Flat Lead (83)
- 8-SMD, Flat Lead Exposed Pad (22)
- 8-SOIC (0.154", 3.90mm Width) (6311)
- 8-SOIC (0.173", 4.40mm Width) (452)
- 8-SOIC (0.209", 5.30mm Width) (600)
- 8-SOIC (0.295", 7.50mm Width) (4)
- 8-TSSOP (0.173", 4.40mm Width) (4187)
- 8-TSSOP, 8-MSOP (0.110", 2.80mm Width) (25)
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) (1433)
- 8-UBGA, WLCSP (12)
- 8-UDFN Exposed Pad (132)
- 8-UFBGA (6)
- 8-UFBGA, CSPBGA (10)
- 8-UFBGA, WLCSP (60)
- 8-UFDFN Exposed Pad (1273)
- 8-VDFN Exposed Pad (124)
- 8-VFBGA (62)
- 8-VFDFN Exposed Pad (336)
- 8-VFSOP (0.091", 2.30mm Width) (4)
- 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) (294)
- 8-VSSOP, 8-MSOP (0.118", 3.00mm Width) (14)
- 8-WDFN Exposed Pad (6)
- 8-WFBGA, WLCSP (8)
- 8-WFDFN Exposed Pad (865)
- 8-WSSOP, 8-MSOP (0.110", 2.80mm Width) (102)
- 8-XFBGA (3)
- 8-XFBGA, WLCSP (26)
- 8-XFDFN (6)
- 9-UFBGA, WLCSP (6)
- M2 J, Smart Card Module (ISO) (87)
- M2 J, Smart Card Module (TWI) (78)
- M2 P, Smart Card Module (ISO) (63)
- M2 P, Smart Card Module (TWI) (69)
- SC-74A, SOT-753 (354)
- SOT-23-5 Thin, TSOT-23-5 (188)
- SOT-23-6 (712)
- TO-226-2, TO-92-2 (TO-226AC) (2)
- TO-226-3, TO-92-3 (TO-226AA) (32)
- TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) (29)
- TO-226-3, TO-92-3 Long Body (4)
- TO-236-3, SC-59, SOT-23-3 (168)
- Supplier Device Package :
-
- 11-VCSP50L2 (2.44x1.99) (2)
- 12-TQFN (4x4) (4)
- 14-DIP (2)
- 14-SOIC (28)
- 14-SOP (6)
- 14-SSOP (6)
- 14-TSSOP (46)
- 16-SOIC (24)
- 16-SSOPB (6)
- 2-SFN (3.5mmx6.5mm) (15)
- 2-SFN (3.5x5) (12)
- 2-SFN (6x6) (28)
- 2-XSFN (5x3.5) (12)
- 20-SOIC (6)
- 20-TSSOP (44)
- 24-PDIP (31)
- 24-SOIC (58)
- 28-CDIP (40)
- 28-CerDip (2)
- 28-CPGA (13.55x15.06) (38)
- 28-Flatpack, Ceramic Bottom-Brazed (38)
- 28-PDIP (178)
- 28-SOIC (345)
- 28-TSOP (294)
- 28-TSSOP (6)
- 28-TSSOP-EP (3)
- 30-CPGA (10)
- 32-CDIP (20)
- 32-DIP (30)
- 32-Flatpack, Ceramic Bottom-Brazed (20)
- 32-LCC (11.43x13.97) (36)
- 32-PDIP (7)
- 32-PLCC (384)
- 32-PLCC (11.43x13.97) (183)
- 32-SOIC (14)
- 32-TSOP (77)
- 32-TSSOP (6)
- 36-TQFN (6x6) (3)
- 4-CSP (29)
- 4-FlipChip (2.39x1.73) (6)
- 4-WLCSP (48)
- 4-WLCSP (0.76x0.76) (4)
- 4-WLCSP (0.80x0.67) (12)
- 4-WLCSP (0.84x0.84) (2)
- 4-WLCSP (0.84x0.86) (18)
- 4-WLCSP (0.85x0.85) (21)
- 4-WLCSP (2x2) (30)
- 4-WLP (0.79x1.06) (4)
- 44-CLCC (16.54x16.54) (14)
- 5-CSP (4)
- 5-TSOP (2)
- 5-UCSP50L1 (1.1x1.15) (6)
- 5-UFDFPN (1.7x1.4) (42)
- 5-WLCSP (14)
- 5-WLCSP (1.20x0.80) (2)
- 5-WLCSP (1.34x0.91) (2)
- 5-WLCSP (3x3) (6)
- 56-CPGA (4)
- 6-FlipChip (2.82x2.54) (12)
- 6-TDFN (3x3) (19)
- 6-TDFN-EP (3x3) (59)
- 6-TSOC (75)
- 6-UCSP25L1 (1.5x1) (6)
- 6-UCSPR (1.68x1.68) (13)
- 6-WLCSP (4)
- 6-WLCSP (1.2x0.80) (10)
- 8-CSP (4)
- 8-dBGA (2x1.5) (2)
- 8-dBGA (3.73x2.35) (10)
- 8-dBGA (4.07x2.47) (12)
- 8-DFN (2x3) (400)
- 8-DFN-S (6x5) (120)
- 8-DIP (202)
- 8-DIP-T (52)
- 8-LAP (2)
- 8-LAP (5x6) (8)
- 8-LAP (5x8) (44)
- 8-MAP (3x4.9) (104)
- 8-MFP (14)
- 8-Mini Map (2x3) (170)
- 8-MLP (2x3) (152)
- 8-MSOP (1371)
- 8-PDIP (1464)
- 8-SAP (4.9x6.0) (24)
- 8-SO (1367)
- 8-SOIC (4352)
- 8-SOIJ (272)
- 8-SON (16)
- 8-SOP (946)
- 8-SOP-J (428)
- 8-SSOP (34)
- 8-SSOPB (262)
- 8-TDFN (57)
- 8-TDFN (2x3) (709)
- 8-TDFN (3x3) (4)
- 8-TDFN (3x4.9) (2)
- 8-TDFN-EP (2x3) (5)
- 8-TMSOP (121)
- 8-TSSOP (3904)
- 8-TSSOP-B (404)
- 8-TSSOP-BJ (238)
- 8-TSSOP-J (22)
- 8-UCSP (3x3) (3)
- 8-uDFN (2x2) (4)
- 8-UDFN (2x3) (478)
- 8-UDFN-EP (2x3) (72)
- 8-UFDFPN (2x3) (250)
- 8-uMAX (1)
- 8-USON (7)
- 8-VCSP50L2 (2.09x1.85) (2)
- 8-VFBGA (1.5x2) (36)
- 8-WLCSP (82)
- 8-WLCSP (1.2x1.2) (6)
- 8-WLCSP (1.35x1.37) (2)
- 8-WLCSP (1.785x1.38) (2)
- 8-WLCSP (1.95x1.765) (2)
- 8-WLCSP (3.12x2.04) (4)
- 8-WLCSP (3.56x2.01) (12)
- 8-WSON (1)
- 8-XDFN (1.8x2.2) (6)
- 9-VCSP50L1 (1.6x1.6) (6)
- M2 - J Module (ISO) (81)
- M2 - J Module (TWI) (78)
- M2 - P Module (ISO) (69)
- M2 - P Module (TWI) (69)
- SC-70-5 (57)
- SNT-8A (74)
- SOT-23 (66)
- SOT-23-3 (102)
- SOT-23-5 (500)
- SSOP-8B (4)
- TO-92-2 (2)
- TO-92-3 (65)
- TSOT-23-5 (40)
- UCSP30L1 (30)
- UCSP35L1 (12)
- US8 (4)
- VCSP30L1 (2)
- VCSP35L2 (6)
- VCSP50L1 (22)
- VSON008X2030 (258)
- VSON8K (3.0x2.0) (2)
- Voltage - Supply :
-
- 0.9 V ~ 3.6 V (2)
- 1.5 V ~ 3.6 V (140)
- 1.5 V ~ 5.5 V (40)
- 1.6 V ~ 3.6 V (10)
- 1.6 V ~ 4.5 V (2)
- 1.6 V ~ 5.5 V (1457)
- 1.62 V ~ 5.5 V (1)
- 1.7 V ~ 3 V (10)
- 1.7 V ~ 3.6 V (630)
- 1.7 V ~ 5.5 V (4118)
- 1.71 V ~ 1.89 V (32)
- 1.8 V ~ 3.6 V (179)
- 1.8 V ~ 5.5 V (6106)
- 1.8 V ~ 6 V (22)
- 2 V ~ 5.25 V (4)
- 2 V ~ 5.5 V (6)
- 2.2 V ~ 5.25 V (6)
- 2.2 V ~ 5.5 V (79)
- 2.4 V ~ 5.5 V (4)
- 2.5 V ~ 3.6 V (22)
- 2.5 V ~ 5.5 V (5279)
- 2.5 V ~ 6 V (4)
- 2.5 V ~ 6.0 V (82)
- 2.7 V ~ 3.6 V (384)
- 2.7 V ~ 4.5 V (22)
- 2.7 V ~ 5.5 V (1293)
- 2.8 V ~ 5.25 V (38)
- 2.85 V ~ 5.25 V (11)
- 2.97 V ~ 3.63 V (69)
- 3 V ~ 3.6 V (182)
- 3 V ~ 5.25 V (15)
- 3 V ~ 5.5 V (6)
- 4.5 V ~ 5.5 V (3182)
- 4.5 V ~ 6 V (12)
- 4.75 V ~ 5.25 V (6)
- Memory Size :
-
- 1.25Kb (32 Bytes x 5 pages) (5)
- 128b (16 x 8) (148)
- 128K (16K x 8) (8)
- 128Kb (16K x 8) (1103)
- 16Kb (1K x 16) (226)
- 16Kb (2K x 8) (2220)
- 16Kb (2K x 8, 1K x 16) (315)
- 1Kb (128 x 8 , 64 x 16) (184)
- 1Kb (128 x 8 or 64 x 16) (18)
- 1Kb (128 x 8) (1996)
- 1Kb (128 x 8, 64 x 16) (306)
- 1Kb (1K x 1) (3)
- 1Kb (256 x 4) (98)
- 1Kb (64 x 16) (460)
- 1Mb (128K x 8) (834)
- 20Kb (256 x 80) (14)
- 256b (16 x 16) (42)
- 256b (32 x 8) (41)
- 256Kb (32K x 8) (1879)
- 2Kb (128 x 16) (400)
- 2Kb (128 x 8 x 2) (40)
- 2Kb (256 x 8) (2794)
- 2Kb (256 x 8, 128 x 16) (498)
- 2Kb (2K x 1) (23)
- 2Mb (256K x 8) (82)
- 32Kb (2K x 16) (96)
- 32Kb (4K x 8) (1502)
- 4Kb (256 x 16) (455)
- 4Kb (256 x 8 x 2) (309)
- 4Kb (4K x 1) (16)
- 4Kb (512 x 8) (1588)
- 4Kb (512 x 8, 256 x 16) (452)
- 4Mb (512K x 8) (24)
- 512b (256 x 2) (20)
- 512b (32 Bytes x 2 pages) (4)
- 512b (512 x 1) (23)
- 512Kb (64K x 8) (851)
- 64Kb (4K x 16) (2)
- 64Kb (8K x 8) (2218)
- 6Kb (256 x 8 x 3) (6)
- 896b (112 x 8) (24)
- 8Kb (1K x 8) (1632)
- 8Kb (1K x 8, 512 x 16) (207)
- 8Kb (256 x 8 x 4) (235)
- 8Kb (512 x 16) (228)
- 8kb (8K x 1) (7)
- Access Time :
- Write Cycle Time - Word, Page :
- Applied Filters :
23636 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Clock Frequency | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
|
RFQ |
2,156
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
1,073
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
870
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
892
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
3,264
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
1,542
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | -40°C ~ 85°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
1,283
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
3,691
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
2,124
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 4.5 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 2ms | SPI | |||
|
|
|
RFQ |
3,243
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8, 1K x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
3,948
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8, 1K x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
3,747
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 16Kb (2K x 8, 1K x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
2,656
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 8Kb (1K x 8, 512 x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
1,191
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 8Kb (1K x 8, 512 x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
2,374
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 8Kb (1K x 8, 512 x 16) | - | 3MHz | EEPROM | 5ms | SPI | |||
|
|
|
RFQ |
1,259
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8, 256 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
2,171
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8, 256 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
2,334
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 4Kb (512 x 8, 256 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
1,442
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 2Kb (256 x 8, 128 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
1,266
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 2Kb (256 x 8, 128 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
3,649
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 2Kb (256 x 8, 128 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
919
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
1,312
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
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|
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RFQ |
3,579
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8 , 64 x 16) | - | 3MHz | EEPROM | 6ms | SPI | |||
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|
|
RFQ |
767
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 6ms | SPI | |||
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|
|
RFQ |
873
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 6ms | SPI | |||
|
|
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RFQ |
798
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (64 x 16) | - | 2MHz | EEPROM | 6ms | SPI | |||
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|
|
RFQ |
3,254
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 6ms | SPI | |||
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|
|
RFQ |
2,026
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 6ms | SPI | |||
|
|
|
RFQ |
2,182
In-stock
|
Microchip Technology | SERIAL EEPROM WAFER | - | Active | - | 0°C ~ 70°C (TA) | - | - | - | 1.8 V ~ 5.5 V | Non-Volatile | 1Kb (128 x 8) | - | 2MHz | EEPROM | 6ms | SPI | |||
