- Series :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
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- Voltage - Supply (Vcc/Vdd) :
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30 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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RFQ |
1,137
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51MM | Active | Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 8x16b, D/A 1x12b | External | |||
|
|
RFQ |
3,356
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51MM | Active | Tray | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 8x16b, D/A 1x12b | External | |||
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|
RFQ |
3,567
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51JE | Active | Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | External | |||
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RFQ |
2,108
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 64WQFN | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFQFN Exposed Pad | 64-HWQFN (9x9) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 256KB (256K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
1,752
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 64WFLGA | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFLGA | 64-FLGA (5x5) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 256KB (256K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
2,548
In-stock
|
Renesas Electronics America | IC MCU 32BIT 128KB FLASH 64WQFN | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFQFN Exposed Pad | 64-HWQFN (9x9) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 128KB (128K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
1,137
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51MM | Active | Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 8x16b, D/A 1x12b | External | |||
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|
RFQ |
3,356
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51MM | Active | Tray | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 8x16b, D/A 1x12b | External | |||
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|
RFQ |
3,567
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51JE | Active | Tray | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | External | |||
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RFQ |
2,108
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 64WQFN | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFQFN Exposed Pad | 64-HWQFN (9x9) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 256KB (256K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
1,752
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 64WFLGA | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFLGA | 64-FLGA (5x5) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 256KB (256K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
2,548
In-stock
|
Renesas Electronics America | IC MCU 32BIT 128KB FLASH 64WQFN | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFQFN Exposed Pad | 64-HWQFN (9x9) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 128KB (128K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
2,719
In-stock
|
Renesas Electronics America | IC MCU 32BIT 128KB FLASH 64WFLGA | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-WFLGA | 64-FLGA (5x5) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 128KB (128K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
1,367
In-stock
|
Renesas Electronics America | IC MCU 32BIT 128KB FLASH 64LQFP | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LFQFP (10x10) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 128KB (128K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
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RFQ |
2,688
In-stock
|
NXP USA Inc. | IC MCU 32BIT 512KB FLASH 64LQFP | LPC2100 | Active | Digi-Reel® | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, POR, PWM, WDT | ARM7® | 60MHz | 3 V ~ 3.6 V | 47 | 32K x 8 | 16/32-Bit | I²C, Microwire, SPI, SSI, SSP, UART/USART | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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RFQ |
2,070
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 64LQFP | LPC2100 | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, POR, PWM, WDT | ARM7® | 60MHz | 3 V ~ 3.6 V | 47 | 32K x 8 | 16/32-Bit | I²C, Microwire, SPI, SSI, SSP, UART/USART | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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RFQ |
1,031
In-stock
|
NXP USA Inc. | IC MCU 32BIT 512KB FLASH 64LQFP | LPC2100 | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, POR, PWM, WDT | ARM7® | 60MHz | 3 V ~ 3.6 V | 47 | 32K x 8 | 16/32-Bit | I²C, Microwire, SPI, SSI, SSP, UART/USART | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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RFQ |
1,842
In-stock
|
NXP USA Inc. | IC MCU 32BIT 128KB FLASH 80LQFP | MCF51MM | Active | Tray | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 128KB (128K x 8) | Flash | - | A/D 8x16b, D/A 1x12b | External | |||
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RFQ |
1,459
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 80LQFP | MCF51JE | Active | Tray | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 256KB (256K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | External | |||
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RFQ |
632
In-stock
|
NXP USA Inc. | IC MCU 32BIT 128KB FLASH 80LQFP | MCF51JE | Active | Tray | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (12x12) | LVD, PWM, WDT | Coldfire V1 | 50MHz | 1.8 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SCI, SPI, USB OTG | 128KB (128K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | External | |||
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RFQ |
834
In-stock
|
NXP USA Inc. | IC MCU 32BIT 256KB FLASH 64LQFP | LPC2100 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, POR, PWM, WDT | ARM7® | 60MHz | 3 V ~ 3.6 V | 47 | 32K x 8 | 16/32-Bit | I²C, Microwire, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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RFQ |
2,972
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64QFN | SAM3S | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
3,584
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64LQFP | SAM3S | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
3,645
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64QFN | SAM3S | Active | Tray | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
2,681
In-stock
|
NXP USA Inc. | IC MCU 32BIT 512KB FLASH 64LQFP | LPC2100 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, POR, PWM, WDT | ARM7® | 60MHz | 3 V ~ 3.6 V | 47 | 32K x 8 | 16/32-Bit | I²C, Microwire, SPI, SSI, SSP, UART/USART | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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RFQ |
3,021
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64QFN | SAM3S | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
3,342
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64LQFP | SAM3S | Active | Digi-Reel® | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
1,882
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64LQFP | SAM3S | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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RFQ |
2,287
In-stock
|
Microchip Technology | IC MCU 32BIT 128KB FLASH 64LQFP | SAM3S | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 64MHz | 1.62 V ~ 3.6 V | 47 | 32K x 8 | 32-Bit | I²C, MMC, SPI, SSC, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 10x10/12b, D/A 2x12b | Internal | |||
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|
RFQ |
2,112
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 64LQFP | RX200 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LFQFP (10x10) | DMA, LVD, POR, PWM, WDT | RXv2 | 54MHz | 1.8 V ~ 5.5 V | 47 | 32K x 8 | 32-Bit | I²C, IrDA, SCI, SPI, SSI | 256KB (256K x 8) | Flash | 8K x 8 | A/D 12x12b, D/A 2x12b | Internal | |||
