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34 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Size / Dimension | Package / Case | Type | Height | Voltage - Supply | Frequency Stability | Function | Output | Frequency - Output 1 | Frequency - Output 2 | |
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GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
1,558
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
3,221
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
1,980
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
2,473
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,654
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,204
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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|
RFQ |
3,701
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
2,832
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS, LVDS | - | - | |||
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RFQ |
3,894
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
2,318
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,545
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,268
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
2,226
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
1,387
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVPECL | - | - | |||
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RFQ |
1,446
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVPECL | - | - | |||
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RFQ |
1,740
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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|
RFQ |
3,969
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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|
RFQ |
1,558
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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|
RFQ |
3,221
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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|
RFQ |
1,980
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
|
|
RFQ |
2,473
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
RFQ |
3,654
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
RFQ |
3,204
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
RFQ |
3,701
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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|
RFQ |
2,832
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS, LVDS | - | - | |||
|
|
RFQ |
3,894
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
RFQ |
2,318
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
2,545
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
1,268
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
RFQ |
2,226
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz |