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88 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Size / Dimension | Package / Case | Type | Height | Voltage - Supply | Frequency Stability | Function | Output | Frequency - Output 1 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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RFQ |
2,895
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | |||
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RFQ |
2,339
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
1,558
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | |||
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RFQ |
943
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
2,758
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
3,605
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | |||
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RFQ |
3,520
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | |||
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RFQ |
2,818
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
2,563
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
1,999
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
2,277
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
662
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
3,545
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
3,482
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | |||
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RFQ |
3,520
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | |||
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RFQ |
3,372
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | |||
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RFQ |
1,980
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | |||
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RFQ |
843
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVPECL | - | |||
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RFQ |
2,812
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | |||
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RFQ |
806
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | |||
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RFQ |
2,473
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | |||
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RFQ |
3,654
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | |||
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RFQ |
2,799
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | |||
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RFQ |
3,247
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | |||
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RFQ |
2,012
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | |||
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RFQ |
2,027
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | |||
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RFQ |
2,066
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | |||
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RFQ |
3,701
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | |||
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RFQ |
1,879
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | - | |||
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RFQ |
2,832
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS, LVDS | - | |||
