- Frequency Stability :
- Frequency - Output 1 :
- Applied Filters :
62 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Size / Dimension | Package / Case | Type | Height | Voltage - Supply | Frequency Stability | Function | Output | Frequency - Output 1 | Frequency - Output 2 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
|
RFQ |
2,895
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
|
|
|
RFQ |
1,558
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
|
|
|
RFQ |
943
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
|
RFQ |
2,758
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
|
RFQ |
3,520
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
|
|
|
RFQ |
2,563
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
2,277
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
662
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
3,545
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
3,221
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
RFQ |
2,854
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
RFQ |
3,482
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | - | |||
|
|
|
RFQ |
3,520
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | - | |||
|
|
RFQ |
3,372
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
|
|
RFQ |
843
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVPECL | - | - | |||
|
|
RFQ |
806
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | - | |||
|
|
RFQ |
3,247
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
RFQ |
2,012
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
RFQ |
3,337
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
|
RFQ |
2,027
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
|
|
RFQ |
2,066
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
RFQ |
1,879
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | - | - | |||
|
|
RFQ |
3,894
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
|
|
|
RFQ |
2,545
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
|
|
|
RFQ |
2,855
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
|
|
|
RFQ |
2,226
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
|
RFQ |
3,318
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
|
|
|
RFQ |
1,446
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVPECL | - | - | |||
|
|
|
RFQ |
2,258
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVPECL | - | - | |||
|
|
|
RFQ |
3,969
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
