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84 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Size / Dimension | Package / Case | Type | Height | Voltage - Supply | Frequency Stability | Function | Output | Frequency - Output 1 | Frequency - Output 2 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
1,867
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,339
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,641
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
3,605
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
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RFQ |
2,857
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
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RFQ |
956
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,161
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
3,720
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | - | |||
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RFQ |
3,722
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
1,958
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
1,232
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,204
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
1,368
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
2,818
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,999
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,980
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
2,812
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | - | |||
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RFQ |
2,473
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,654
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
2,799
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,204
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVCMOS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
3,701
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
2,318
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,823
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±25ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,702
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
907
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
852
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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RFQ |
1,483
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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RFQ |
2,815
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tape & Reel (TR) | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
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RFQ |
3,768
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | 25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | |||
