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94 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Size / Dimension | Package / Case | Type | Height | Voltage - Supply | Frequency Stability | Function | Output | Current - Supply (Max) | Frequency - Output 1 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
3,082
In-stock
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Microchip Technology | MEMS OSCILLATOR | DSC61XX | Active | Tube | -40°C ~ 85°C | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 4-SMD, No Lead | MEMS (Silicon) | 0.035" (0.89mm) | 1.71 V ~ 3.63 V | ±50ppm | Enable/Disable | CMOS | 3mA (Typ) | - | |||
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RFQ |
798
In-stock
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Microchip Technology | MEMS OSCILLATOR | DSC61XX | Active | Tube | -20°C ~ 70°C | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 4-SMD, No Lead | MEMS (Silicon) | 0.035" (0.89mm) | 1.71 V ~ 3.63 V | ±50ppm | Enable/Disable | CMOS | 3mA (Typ) | - | |||
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RFQ |
3,401
In-stock
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Microchip Technology | MEMS OSCILLATOR | DSC61XX | Active | Tube | -40°C ~ 85°C | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 4-SMD, No Lead | MEMS (Silicon) | 0.035" (0.89mm) | 1.71 V ~ 3.63 V | ±50ppm | Enable/Disable | CMOS | 3mA (Typ) | - | |||
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RFQ |
1,867
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,183
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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RFQ |
3,871
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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RFQ |
1,641
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,892
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
3,389
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
2,857
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
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RFQ |
3,493
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
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RFQ |
950
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
956
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
3,202
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
1,143
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
3,346
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
626
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | - | |||
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RFQ |
1,279
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS, LVDS | - | - | |||
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RFQ |
3,165
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVDS | - | - | |||
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RFQ |
3,234
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVPECL | - | - | |||
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RFQ |
3,720
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | - | |||
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RFQ |
3,495
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS, LVPECL | - | - | |||
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RFQ |
1,232
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -40°C ~ 85°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
1,407
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
2,233
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVCMOS | - | - | |||
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RFQ |
3,306
In-stock
|
Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL, LVCMOS | - | - | |||
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RFQ |
1,106
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | HCSL | - | - | |||
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RFQ |
655
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC400 | Active | Tube | -20°C ~ 70°C | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 20-VFQFN Exposed Pad | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | LVDS | - | - | |||
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RFQ |
3,959
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC2311 | Active | Tube | -40°C ~ 105°C | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 6-SMD, No Lead | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | CMOS | - | - | |||
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RFQ |
1,185
In-stock
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Microchip Technology | OSC MEMS CONFIGURABLE OUTPUT | DSC2311 | Active | Tube | -40°C ~ 85°C | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 6-SMD, No Lead | MEMS (Silicon) | 0.035" (0.90mm) | 2.25 V ~ 3.6 V | ±50ppm | Enable/Disable | CMOS | - | - | |||
