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12 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC, FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||||
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RFQ |
3,276
In-stock
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Amphenol FCI | CONN FPC BOTTOM 18POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 18 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,581
In-stock
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Amphenol FCI | CONN FPC BOTTOM 26POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 26 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
1,234
In-stock
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Amphenol FCI | CONN FPC BOTTOM 24POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 24 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,520
In-stock
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Amphenol FCI | CONN FPC BOTTOM 16POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
1,480
In-stock
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Amphenol FCI | CONN FPC BOTTOM 15POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 15 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,952
In-stock
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Amphenol FCI | CONN FPC BOTTOM 20POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,350
In-stock
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Amphenol FCI | CONN FPC BOTTOM 30POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
3,773
In-stock
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Amphenol FCI | CONN FPC BOTTOM 14POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 14 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,575
In-stock
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Amphenol FCI | CONN FPC BOTTOM 10POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
3,389
In-stock
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Amphenol FCI | CONN FPC BOTTOM 12POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
3,998
In-stock
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Amphenol FCI | CONN FPC BOTTOM 12POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 12 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
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RFQ |
2,858
In-stock
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Amphenol FCI | CONN FPC BOTTOM 8POS 0.50MM R/A | VLL | Active | Cut Tape (CT) | -55°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.051" (1.30mm) | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock, Backlock | Tapered | Polyamide (PA9T), Nylon 9T, Glass Filled | |||
