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7 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC, FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||||
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|
RFQ |
3,000
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | $proddata[$product['id']]['package'] | FA5 | Active | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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|
|
RFQ |
3,000
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | $proddata[$product['id']]['package'] | FA5 | Active | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
|
|
|
RFQ |
3,000
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | $proddata[$product['id']]['package'] | FA5 | Active | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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|
|
RFQ |
1,446
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
|
|
|
RFQ |
1,308
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
|
|
RFQ |
2,470
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
|
|
RFQ |
3,183
In-stock
|
JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
